What is IEC 60068-2-47 Ed3 2018?

The IEC 60068-2-47 Ed3 2018 is a standard document published by the International Electrotechnical Commission (IEC). This technical standard provides guidance on the performance testing of electronic products under high temperature conditions. It covers various aspects such as measurement methods, evaluation criteria, and test procedures.

Understanding the Purpose

The purpose of IEC 60068-2-47 Ed3 2018 is to assess and evaluate the ability of electronic products to withstand high temperatures during operation. By creating standardized testing procedures, this standard allows manufacturers and consumers to objectively compare the thermal performance of different electronic devices. It helps ensure that electronic products can function safely and reliably even in harsh environments.

Key Features of IEC 60068-2-47 Ed3 2018

This updated version of the standard incorporates several key features. Firstly, it specifies the equipment needed to conduct the tests, such as the thermal chamber, measuring devices, and data acquisition systems. Secondly, it outlines the test conditions, including the temperature range, duration, and rate of change. Thirdly, it defines the measurement parameters for evaluating the thermal performance, such as heat dissipation, temperature rise, and thermal resistance.

In addition, the standard also provides information on calculating the air velocity and distribution inside the thermal chamber. It offers guidelines for positioning the test samples and determining the appropriate number of sensors for accurate measurements. Furthermore, it discusses the interpretation of test results and provides criteria for passing or failing the tests based on predefined thresholds.

Benefits and Application

The IEC 60068-2-47 Ed3 2018 standard brings several benefits to both manufacturers and consumers. Firstly, it ensures that electronic products meet the necessary safety requirements and can operate reliably under high temperature conditions. This helps prevent potential failures and malfunctions in real-world applications.

Moreover, the standard enables manufacturers to improve their product designs by identifying hotspots and areas prone to thermal stresses. It promotes the development of more efficient cooling systems and helps optimize the overall thermal performance of electronic devices. Additionally, it allows consumers to make informed decisions when purchasing electronic products, knowing that they have been tested according to reliable industry standards.